研究了时效对Cu-0.15Ag-0.1Fe合金的显微硬度、抗拉强度和电导率的影响。结果表明：随着时效时间的增加和时效温度的升高,Cu-0.15Ag-0.1Fe合金的显微硬度和抗拉强度先急剧增加随后逐渐降低;合金经960℃×1 h固溶,在500℃时效2 h后可获得较好的显微硬度和抗拉强度,分别为124 HV和442 MPa;当时效时间增加到6 h,可获得较高的电导率,达到82.5%IACS。通过透射显微镜分析,该合金中的强化相是γ-Fe粒子,与以前报道的Cu-Fe系合金的析出强化相是α-Fe不同。
Effect of aging treatment on microhardness,tensile strength and electric conductivity of Cu-0.15Ag-0.1Fe alloy was studied.The results show that the microhardness and the tensile strength of Cu-0.15Ag-0.1Fe alloy increased rapidly with increasing the aging time and temperature and then decreased slowly.Higher microhardness and tensile strength can be obtained for the alloy after solution at 960 ℃ for 1 h and aging at 500 ℃for 2 h,the microhardness is 124 HV and the tensile strength is 442 MPa.After aging at 500 ℃for 6 h,the electric conductivity reaches 82.5%IACS.The strengthening phase in the alloy is γ-Fe particle by transmission electron microscopy,which is different from the previous reports that the strengthening phase is α-Fe in Cu-Fe alloys.
参考文献
| [1] | Batra IS.;Kulkarni UD.;Banerjee S.;Dey GK. .Microstructure and properties of a Cu-Cr-Zr alloy[J].Journal of Nuclear Materials: Materials Aspects of Fission and Fusion,2001(2):91-100. |
| [2] | Ten;sick M J;Davies H A .Enhanced strength in high conductivity copper alloys[J].Materials Science and Engineering,1988,98(02):543-546. |
| [3] | Sakai Y;Inoue K;Maeda H .New high-strength,high-conductivity Cu-Ag ahoy sheets[J].Acta Materialia,1995,43(04):1517-1522. |
| [4] | 曹兴民,向朝建,杨春秀,慕思国,郭富安.一种新型Cu-Fe-P系合金材料的组织性能分析[J].稀有金属材料与工程,2007(z3):527-529. |
| [5] | D.G.Morris;A.Benghalem .Influence of solidification conditions, thermomechanical processing, and alloying additions on the structure and properties of in situ composite Cu-Ag alloys[J].Scripta materialia,1999(10):1123-1130. |
| [6] | 宋练鹏,尹志民,孙伟,戴姣燕,吴燕华.形变热处理对Cu-Ag-Cr和Cu-Ag-Zr合金组织和性能的影响[J].材料热处理学报,2006(06):66-69. |
| [7] | 刘勇,刘平,田保红,贾淑果,王艳蕊.接触线用微合金化Cu-Ag-Cr合金时效析出行为和电磨损机理探讨[J].材料热处理学报,2007(z1):34-37. |
| [8] | 刘平,贾淑果,郑茂盛,任凤章.微量Zr对Cu-Ag合金磨损行为的影响[J].材料研究学报,2006(01):109-112. |
| [9] | S.I.Hong;M.A.Hill .Microstructural stability and mechanical response of Cu-Ag microcomposite wires[J].Acta materialia,1998(12):4111-4122. |
| [10] | 袁振宇,董企铭,刘平,康布熙,赵冬梅,田保红.时效对Cu-Cr-Zr合金显微硬度及导电率的影响[J].洛阳工学院学报(自然科学版),2002(01):8-11. |
| [11] | 涂思京,闫晓东,谢水生.引线框架用铜合金C194的组织性能研究[J].稀有金属,2004(01):199-201. |
| [12] | 马行驰,黄金亮,贾淑果,刘平,田保红.时效对列车接触网导线用Cu-Ag-Zr合金性能的影响[J].热加工工艺,2004(08):35-37. |
- 下载量()
- 访问量()
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%