Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability

材料科学技术（英文）, 2005, 21(3): 419-422.

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1.State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China;Department of Material Science and Engineering, Jiamusi University, Jiamusi 154007, China

2.State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

3.State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

4.State Key Laboratory of Advanced Welding Production Technology, Harbin Institute of Technology, Harbin 150001, China

Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability

Keywords： Solder joint

A comprehensive experimental and numerical study of solder joints for plastic leaded chip carrier (PLCC) 84-Pin,1.27 mm pitch was carried out. The reliability of solder joints was assessed through accelerated thermal cycling at the temperature range of -55℃～125℃. The samples were taken out to observe the evolution in microstructure, such as grain coarsening, initiation and propagation of cracks. It was found that the Pb-rich phases segregated gradually and formed a continuous layer adjacent to the intermetallic compound (IMC) layer with increasing the number of thermal cycles, resulting in cracks near the solder/lead interface. The response of stress and strain was studied using nonlinear finite element method (FEM), and the results agreed well with the experimental data.

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材料期刊网

Experimental and Finite Element Method Studies of J-Lead Solder Joint Reliability

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