介绍了LED散热基片（金刚石-铜）的基本连接方式，分析金刚石与金属材料的直接焊接和金刚石先表面金属化后再和金属焊接的两种方式，概述了金刚石焊接检测技术并提出了金刚石钎焊存在的相关问题。对依次镀钛、银薄膜的金刚石块和镀银铜基片在500℃进行真空焊接研究，对焊接前后的样品进行XRD衍射分析得知：镀钛银的金刚石薄膜在焊接时，钛金属与金刚石表面的碳原子形成了碳化钛。
The basic structure of Light Emitting Diode(LED)was introduced. The direct welding between diamond and metal, and the welding between surface metalized diamond and metal were analyzed. Detecting techniques in diamond welding were introduced and the problems about diamond welding to metal were proposed. Vacuum-welding at 500 ℃ of diamond with deposited titanium,silver to copper with a buffer layer of silver was researched,and the components of welding interface were investigated using X-ray diffraction(XRD). The results show that titanium reacts with carbon in welding process,and then produces titanium carbide(TiC).
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