为了提高Ni-P化学镀层的抗腐蚀性能,在由NiSO4·6H2O25 g/L、NaH2PO2·H2O 25 g/L、C6H5O7Na3·2H2O 12 g/L和CH3COONa20 g/L组成的Ni-P镀液中加入不同质量浓度的无水硫酸铜,制备了Ni-Cu-P镀层.通过浸泡、动电位极化和电化学阻抗谱(EIS)考察了Ni-Cu-P和Ni-P镀层在5％(质量分数)H2SO4溶液中的耐蚀性,采用扫描电镜(SEM)观察了镀层的表面形貌.结果表明,加入CuSO4后得到的Ni-Cu-P镀层比Ni-P镀层结晶更细小、致密,在硫酸溶液中表现出更好的抗腐蚀性能.当镀液中硫酸铜质量浓度为0.50 g/L时,得到的Ni-Cu-P镀层晶粒最小、致密性最好,其膜电阻和电荷转移电阻达到最大,分别是Ni-P镀层的4倍和32倍.
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