Transmission electron microscopy evidence was obtained to elucidate the mechanism for Bi-induced interfacial void formation in solder joints. After thermal aging, Bi segregated to the Cu3Sn/Cu to form fine particles on the interface in SnBi/Cu solder joints. Interfacial voids were found near the interfacial Bi particles. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.
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