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采用Gleeble-3500热模拟试验机和背散射电子衍射(EBSD)技术分析研究了Cu-P-Cr-Ni-Mo耐候钢在(γ+α)两相区不同变形量和不同变形温度下的组织演变,探究了铁素体晶粒的细化机理.结果表明,Cu-P-Cr-Ni-Mo耐候钢在750℃,应变速率为0.01 s-1变形时,当应变超过0.69后,铁素体的转变量增加不明显,但等轴铁素体晶粒数量增加,新形成的细小等轴再结晶铁素体晶粒尺寸达到1.4~3 μm;在850~750℃、应变速率为0.01 s-1变形时,随着变形温度的降低,铁素体转变量增加,铁素体晶粒尺寸减小,但均匀性降低.Cu-P-Cr-Ni-Mo耐候钢(γ+α)两相区铁索体晶粒细化机制为铁素体的连续动态再结晶,并且随着变形温度的降低,发生铁素体的连续动态再结晶的能力增强.

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