首先描述了厚膜电阻的基本结构,介绍了制作厚膜电阻的各种材料,然后详细地阐述了厚膜电阻的制备工艺,探讨了厚膜电阻的导电机理和近年来的发展趋势.
参考文献
| [1] | 张显,朱耀寰,王海丰.烧结温度对厚膜电阻的影响研究[J].电子器件,2012(04):394-398. |
| [2] | 李文兵,李祥友,曾晓雁.用激光微细熔覆法直写电阻浆料制备厚膜电阻[J].功能材料,2005(01):80-82. |
| [3] | 丁鹏,马以武.钌基厚膜电阻导电机理的国内外研究状况[J].电子器件,2003(03):264-268. |
| [4] | Kim Jung Min;Kim Young Kwan .Thin crystalline silicon solar cell bonded to intered substrate with aluminum paste[J].Solar Energy Materials & Solar Cells,2005,86(04):577. |
| [5] | 陈丙根,金家存.不锈钢基板厚膜电阻工艺研究[J].安徽电子信息职业技术学院学报,2009(05):36-38. |
| [6] | 唐高峰,杨传仁,张继华,陈宏伟,赵强.LSCO厚膜电阻浆料的制备与电性能研究[J].物联网技术,2012(06):53-55. |
| [7] | 银锐明,堵永国,张为军,芦玉峰.BaPbO3/Ag复合体系大功率厚膜电阻浆料的研究[J].材料科学与工程学报,2006(03):366-369. |
| [8] | 陆广广,宣天鹏.电子浆料的研究进展与发展趋势[J].金属功能材料,2008(01):48-52. |
| [9] | 李同泉 .厚膜电阻浆料有机载体的改进[J].电子元件与材料,1997,16(02):47. |
| [10] | Schoch K F .Conductive adhesives for electronics packaging[J].IEEE Electrical Insulation Magazine,2003,19(02):46. |
| [11] | 张君,郭伟,袁倬斌.用丝网印刷技术制备薄膜微电极的方法研究[J].分析化学,2005(07):1045-1048. |
| [12] | 李文兵,李祥友,曾晓雁.激光微细熔覆电阻浆料直写电阻技术初步研究[J].激光技术,2005(02):123-125,134. |
| [13] | 刘希富.厚膜电阻导电机理的探讨[J].盐城工学院学报(自然科学版),2003(03):65-66,73. |
| [14] | 高伟,张国春,罗玉林,韩文,杨宗炼.无铅钝化玻璃材料的研制与应用[J].电子元件与材料,2006(07):63-65. |
| [15] | 邓国珠 .PTC热敏陶瓷电极的老化研究[J].电子元件与材料,1995,14(05):32. |
| [16] | 孙文通 .贱金属电极浆料导电机理研究[J].电子元件与材料,1997,16(03):14. |
| [17] | 吴懿平,吴大海,袁忠发,吴丰顺,安兵.镀银铜粉导电胶的研究[J].电子元件与材料,2005(04):32-35. |
| [18] | 喻冬秀,文秀芳,皮丕辉,程江,杨卓如.电磁屏蔽涂料用复合型导电填料研究进展[J].化工进展,2006(08):890-894. |
| [19] | Lin J C;Wang C Y.Effects of surfactant treatment of sliver power on the rheology of its thick film[J].Materials Chemistry and Physics,1996(45):136. |
| [20] | Sudo T. .Present and future directions for multichip module technologies[J].IEEE Journal of Solid-State Circuits,1995(4):436-442. |
| [21] | Smith D P H;Anderson J C .The design of composite resistors[J].IEEE Trans Chrnt,1981,4(03):261. |
| [22] | Trease R E;Dietz R L.Rheology of paste in thick-film printing[J].Solid State Technology,1972(01):38. |
| [23] | Chiou Bi-Shiou;Vest R W .Glass for high temperature thick-film systems[J].Ceramic Bulletin,1984,63(06):816. |
| [24] | Adachi K.;Kuno H. .Effect of Glass Composition on the Electrical Properties of Thick-Film Resistors[J].Journal of the American Ceramic Society,2000(10):2441-2448. |
| [25] | Noda M;Sugiyama H;Okuyama M .Study on a metal-ferroelectric oxide-semiconductor structure with thin silicon oxide film using SrBi2Ta2 O9 ferroelectric films prepared by pulsed laser deposition[J].japanese journal of applied physics part 1-regular papers short notes & review papers,1999,38(09):5432. |
| [26] | Shan J S;Berrin L .Mechanism and control of post-trim drift of laser-trimmed thick-film Resistors[J].IEEE Trans Ghmt,1978,1(02):130. |
| [27] | Kurihara Y.;Takahashi S. .Laser trimming of thick film resistors on aluminum nitride substrates[J].IEEE transactions on components, hybrids, and manufacturing technology,1990(3):596-602. |
| [28] | Stanirnirovi I;Jevtic M M et al.High-voltage pulse stressing of thick-film resistors and noise[J].Microelectronics Reliability,2003,43:905. |
| [29] | Pike G E;Seager C H .Electrical properties and conduction mechanisms of Ru-based thick-film (cermet) resistors[J].Journal of Applied Physics,1977,48(12):5152. |
| [30] | Ketkar SA;Umarji GG;Phatak GJ;Ambekar JD;Mulik UP;Amalnerkar DP .Effect of glass content variation on properties of photoimageable silver conductor paste[J].Materials Chemistry and Physics,2006(1):145-153. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%