以纸张为主要原料,经树脂浸泡,成型、碳化后制得层状碳模板,再经液相Si的原位反应制得SiC/Si层状陶瓷.研究了不同热处理工艺对SiC/Si层状陶瓷复合材料表面裂纹和强度的影响.结果表明:SiC/Si层状陶瓷材料在900~1400℃温度下,材料表面压痕裂纹出现不同程度的自愈合现象,材料的抗弯强度大幅度提高.确立了材料表面裂纹的最佳热处理工艺,并对SiC/Si层状陶瓷材料表面裂纹的愈合机理进行了探讨.
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