介绍了铁基无氰滚镀铜工艺条件和镀液的维护，提出以总有效配位剂和铜离子含量的比值(n)作为控制和维护镀液的依据，n保持在1.1~1.4为宜。重点阐述了无氰滚镀铜工艺中的常见故障和解决措施。
The process conditions and bath maintenance of cyanide-free barrel copper plating on iron substrate were introduced. It is proposed that the bath can be controlled and maintained based on the proportion of total effective complexing agent vs. copper ions content (n), which is optimal at 1.1~ 1.4. Some common malfunctions and their corresponding solutions for cyanide-free barrel copper plating were empathetically stated.
参考文献
| [1] | 宋邦才,张军,闫洁.焦磷酸盐滚镀铜工艺研究与应用[J].石油化工腐蚀与防护,2005(04):35-37. |
| [2] | 吴双成.光亮焦磷酸盐滚镀铜[J].材料保护,2000(02):11-12. |
| [3] | 徐金来,赵国鹏,胡耀红.无氰电镀工艺研究与应用现状及建议[J].电镀与涂饰,2012(10):48-51. |
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