为了开发一种成本低廉、环境友好且镀层性能好的化学镀铜工艺,以草酸电解还原溶液为还原剂在A3钢表面进行化学镀铜。探讨了镀液组成、pH值及温度对镀铜速度、镀液稳定性及镀层附着力的影响。结果表明:最佳工艺为12~15g/L CuSO4,30~40g/LEDTA,10~20mg/L2,2’-联吡啶,10~12g/L乙醛酸+5—7g/L草酸(草酸电解还原溶液),pH=12,温度50℃,时间30min;所得镀层附着力良好,外观均匀光亮,镀速达2.2μm/,h,且镀液稳定。本工艺无污染、成本低,为化学镀铜提供了一种新的绿色环保工艺。
参考文献
[1] | Shacham-Diamand Yosi;Lopatin Sergey .Integrated electroless metallization for ULSI[J].Electrochimica Acta,1999(21):3639-3649. |
[2] | Garza M.;Liu J.;Magtoto NP.;Kelber JA. .Adhesion behavior of electroless deposited Cu on Pt/Ta silicate and Pt/SiO2[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2004(1/4):253-262. |
[3] | 陈范才;肖鑫;周琦.现代电镀技术[M].北京:中国纺织出版社,2009:235-257. |
[4] | Lee C Y;Huang T H .Electroless copper employing hypophosphite as a reducing agent[P].US,6046107,2000-04-04. |
[5] | Grunwald J .Method for electroless copper deposition using a hypophosphite reducing agent[P].US,6524490,2003-02-25. |
[6] | Brasch .Formaldehyde-free electroless copper plating solutions[P].US,4877450,1989-10-10. |
[7] | Jagarmathan .Electroless copper plating bath[P].US,4818286,1989-04-20. |
[8] | Sato Y;Sone M;Saito M et al.Electroless copper plating solution and electroless dopper plating method[P].JP,2002-241953,2002-08-28. |
[9] | Takano Y;Senda A .Electroless copper plating bath[P].JP,6340979 (A),1994-12-13. |
[10] | Honma H;Komatsu S;Fujinawi T .Electroless copper dep-osition using glyoxylic acid reducing agent[J].Journal of the Surface Finishing Society of Japan,1991,42(09):913-917. |
[11] | Honma H;Kobayashi T .Electroless copper deposition pres-ence using glyoxylic acid as a reducing agent[J].Journal of the Electrochemical Society,1994,141(03):730-733. |
[12] | Shacham-Diamand Y .Electroless copper deposition using glyoxylic acid as reducing agent for ultralarge scale integration metalliztion[J].Electrochem Solid-State Let,2000,3(06):279-282. |
[13] | Lin YM.;Yen SC. .Effects of additives and chelating agents on electroless copper plating[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2001(1/4):116-126. |
[14] | 蔡洁,张业,姚玉环.葡萄糖含量对钢铁酸性化学预镀铜层性能的影响[J].材料保护,2010(02):38-40. |
[15] | 文斯雄.钢铁零件化学抛光工艺简介[J].材料保护,2003(01):63-63. |
[16] | 刘万民;陈范才;叶一鸣 等.Pb/POT-TiO2电极的制备及其电化学性能[J].湖南大学学报(自然科学版),2004,31(增刊):1-3. |
[17] | 刘树彬,陆敏,张星辰,张萍,牟微.乙醛酸和草酸的高效液相色谱分析[J].应用化工,2007(10):1027-1029. |
[18] | GB/T9798--2005/IS01458.金属基体上的金属覆盖层--电沉积和化学沉积层--附着强度试验方法评述[S]. |
[19] | 欧雪梅,朱正旺,崔永莉.稳定剂对96Al2O3陶瓷表面化学镀铜的影响[J].表面技术,2005(01):17-18,45. |
[20] | 钟丽萍,赵转青,黄逢春.化学镀铜溶液稳定性和沉铜速率的研究[J].材料保护,2001(06):26-27. |
[21] | 王鸿显,赵红坤.甘油铜络合物溶液化学镀铜的研究[J].腐蚀科学与防护技术,2007(03):178-180. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%