采用高能球磨的机械合金化法合成Sn-Cu二元合金超细粉体,对在球磨过程中粉体的结构演变、颗粒形貌、粒径分布及熔化特性进行了研究,讨论了合金化机制.结果表明:球磨粉体由Sn(Cu)过饱和固溶体及Cu6Sn5构成.在球磨初期,Cu、Sn颗粒相互迭加、冷焊,形成复合层块;随后,复合层块断裂碎化,球形颗粒相互团聚构成大的团粒;最后,团粒解散,小颗粒进一步细化.球磨60 h后,Sn-Cu合金粉体的平均粒径(d50)为1～3 μm,且随Cu含量由0.7 wt%增加到10 wt%,Sn-Cu合金粉颗粒形貌由不规则绒絮状变化到球状,熔点由231℃降低到288℃.
参考文献
| [1] | 周甘宇,王长振,谭维,章四琪.无铅焊锡的研究进展[J].材料导报,2003(08):25-27. |
| [2] | Mulu G A;Guna S Y .Lead-free solders in microelectronics[J].Materials Science and Engineering A,2000,271:95-141. |
| [3] | J.D.Sigelko .Overview of lead-free solders[J].Advanced Materials & Processes,2000(3):47-48. |
| [4] | Yoon J W;Jung S B .High temperature reliability and interracial reaction of eutectic Sn-0.7Cu/Ni solder joints during isothermal aging[J].Microelectronics Reliability,2006,46:905-914. |
| [5] | 杨彦明,蒋渝,陈家钊,涂铭旌.等离子体法制备纳米Zn粉工艺研究[J].材料开发与应用,2004(01):29-31. |
| [6] | 张曙光,杨必成,杨博,徐骏,石力开,朱学新.新型超声雾化技术制备球形金属粉末[J].金属学报,2002(08):888-892. |
| [7] | 黄迎红,华林.电子组装用焊锡粉雾化制备技术现状与发展[J].电子工艺技术,2007(02):63-66,70. |
| [8] | 汤文明,郑治祥,吴玉程,唐红军,董季玲.机械合金化及热处理过程中Ti33B67二元系统的结构演变[J].材料热处理学报,2005(02):51-54. |
| [9] | 汤文明,郑治祥,唐红军,吴玉程,任榕,汤志鸣.原位TiB2/Fe3Al基纳米复合材料的合成及其晶粒生长动力学（Ⅰ）--Fe-Al-Ti-B四元粉体的机械合金化[J].材料热处理学报,2006(03):45-49. |
| [10] | Benjamin J S .Mechanical alloying[J].Scientific American Magazine,1970,234(05):40-48. |
| [11] | C. Suryanarayana .Mechanical alloying and milling[J].Progress in materials science,2001(1/2):1-184. |
| [12] | 刘昕,雷永平,夏志东,史耀武,张曙光.无铅钎料Sn-0.7Cu机械合金化研究[J].电子工艺技术,2004(06):239-242. |
| [13] | 刘昕,夏志东,雷永平,史耀武.球磨条件对Sn-0.7Cu合金形成的影响[J].焊接学报,2005(05):9-12. |
| [14] | 徐红梅,严红革,陈振华.固液反应球磨制备Cu-Sn金属间化合物[J].有色金属,2006(02):8-10,14. |
| [15] | CHEN Ding;WU Wei;CHEN Zhen-hua et al.Preparation for intermetallic powders of Cu-Sn and Cu-Ni-Sn systems via solid-liquid reaction milling technique[J].Transactions of Nonferrous Metals Society of China,2007,17:594-598. |
| [16] | 贺博,熊永红,熊曹水,何洪涛,韦世强.机械合金化Cu-Sn二元形状记忆非晶态合金的XAFS研究[J].核技术,2003(08):569-572. |
| [17] | 李才巨,张继东,朱心昆,史冰川,唐海林,林杰,徐孟春.高能球磨法制备纯铝纳米晶材料的研究[J].粉末冶金技术,2006(06):457-459. |
| [18] | Chao B;Chae SH;Zhang XF;Lu KH;Ding M;Im J;Ho PS .Electromigration enhanced intermetallic growth and void formation in Pb-free solder joints[J].Journal of Applied Physics,2006(8):84909-1-84909-10-0. |
| [19] | TANG Wen-ming,HE An-qiang,LIU Qi,D. G. IVEY.Solid state interfacial reactions in electrodeposited Cu/Sn couples[J].中国有色金属学报（英文版）,2010(01):90-96. |
| [20] | Bandyopadhyay A K;Sen S K .A study of intermetallic compound formation in a copper-tin bimetallic couple[J].Journal of Applied Physics,1990,67(08):3681-3688. |
| [21] | Suh JO;Tu KN;Tamura N .Preferred orientation relationship between Cu6Sn5 scallop-type grains and Cu substrate in reactions between molten Sn-based solders and Cu[J].Journal of Applied Physics,2007(6):063511-1-063511-7-0. |
| [22] | 汤文明,HE An-qiang,LIU Qi,IVEY G D.电沉积Ag/Sn偶界面反应及其动力学[J].中国有色金属学报,2009(05):930-935. |
| [23] | Nakahara S;Mccoy R J;Buene L et al.Rom-temperature-diffusion studies of Au-Sn thin-film couple[J].Thin Solid Films,1981,84:185-196. |
| [24] | Szu-Tsung Kao;Jenq-Gong Duh .Effect of Cu Concentration on Morphology of Sn-Ag-Cu Solders by Mechanical Alloying[J].Journal of Electronic Materials,2004(12):1445-1451. |
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