在苯并噁嗪/环氧树脂两元体系中,加入不同比例的酚醛树脂,研究其反应动力学及流变特性.采用该体系为基体制备了覆铜板,并对覆铜板的耐热性、吸水率及介电性能进行测试.结果表明:提高酚醛树脂的含量,有利于降低反应体系的固化温度,提高覆铜板的热失重温度(Td5%);但随着酚醛树脂含量的增加,体系的介电性能下降,玻璃化转变温度(Tg)呈现先上升后下降的趋势,吸水率呈先下降后上升的趋势.当酚醛树脂含量达到12%时,体系的综合性能最佳,其Tg达到204℃,高压蒸煮(PCT)吸水率为0.44%,且加工窗口较宽.
The different contents of phenolic resin were added into benzoxazine/epoxy resin binary system, and its curing reaction kinetics and rheology behavior were stutied. A copper clad laminate (CCL) was prepared using this system as matrix, and its thermal stability, water absorption, and dielec-tric properties were tested. The results show that the increase of phenolic resin content could decrease the curing temperature of the resin system and raise the thermal decompositon temperature (Td5%) of the CCL. With the increase of phenolic resin content, the dielectric properties decrease, the glass transition temperature (Tg) increase first and then decrease, and the water absorption decrease first and then increase. When the phenolic resin content reaches 12%, the system has the best comprehensive property, the Tg reaches 204℃, the water absorption is 0.44%, and the processing window is wide.
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