采用带有RHEED的MBE技术,利用RHEED图像演变实时监控薄膜生长状况,通过RHEED强度振荡测算薄膜生长速率,在GaAs (001)基片上同质外延GaAs薄膜.利用STM对MBE生长的GaAs薄膜表面的熟化过程进行了深入研究.研究发现,随着退火时间的延长,刚完成生长的GaAs表面从具有大量岛和坑的粗糙表面逐渐熟化,在熟化过程中岛不断合并扩大并与平台结合,而坑却逐渐消失.指出当熟化过程完成后GaAs表面将进入原子级平坦状态,并详细解释了熟化过程GaAs表面各种形貌特征形成的内在原因.
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