近来,聚合物热电材料因其成本低、资源丰富、热导率低等优势被认为是最有前途的热电材料之一.聚噻吩及其衍生物是研究较为广泛的一类聚合物热电材料.综述了近年来聚噻吩、聚噻吩衍生物以及聚噻吩基/无机复合热电材料在热电领域的研究进展.已有研究表明,聚噻吩及其衍生物热电材料具有高的Seebeck系数,其Seebeck系数与电导率通常是此消彼长的关系.通过制备低维材料,与高电导率的无机纳米材料复合以及适度掺杂等方法可有效提高聚噻吩及其衍生物的热电性能.
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