Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints

稀有金属（英文版）, 2007, 26(1): 51-55.

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1.School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471003,China

2.School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471003,China

3.School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471003,China

4.School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471003,China

5.School of Materials Science and Engineering,Henan University of Science and Technology,Luoyang 471003,China

基金项目: Luoyang Advanced Hydraulic Pressure Technology Ltd(6142004) the Foundation of Henan University of Science & Technology(13420060)

Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints

Keywords： composite solder

Lap joints with a 1 mm2 cross-sectional area were fabricated using Cu particle enhancement 63Sn37Pb based composite solder and 63Sn37Pb eutectic solder to examine the influence of stress on the creep behavior of the solder joints.The results indicate that the creep resistance of the composite solder joints is generally superior to that of the conventional 63Sn37Pb solder joints.At the same time,the creep rupture life of the composite solder joints is declined with increasing stress and drops faster than that of the 63Sn37Pb eutectic solder joints.

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Influence of stress on the creep behavior of Cu particle enhancement SnPb based composite solder joints

参考文献