为了摒弃化学镀铜中价格昂贵、环境污染的活化工艺,将分子自组装技术与激光诱导化学镀技术结合,在聚酰亚胺薄膜(PI)上成功实现了图形化微米级金属铜沉积:将PI薄膜通过KOH溶液进行表面水解;经离子交换和高温处理在PI表面束缚纳米银粒子,在PI表面自组装上一层十二硫醇的自组装膜;再用聚焦的激光光刻产生预期的图形,最后实施化学镀后,在PI表面上实现金属铜的图形化沉积.采用XPS,AFM,SEM,ATR-FTIR,半导体特性分析系1统和视频光学接触角测量仪等跟踪表征各过程.结果显示:沉积的铜线宽度为30μm,选择性、导电性良好,本法为化学镀技术提供一种新技术,可用于电子行业.
A new method for molecular self-assembly and electroless Cu plating of laser-induced patterning on polyimide film is reported.Thus the surface of the polyimide film was hydrolyzed using aqueous KOH,followed by entrapping of Ag nanoparticles via ion-exchange and annealing at elevated temper ature.Then dodecanethiol monolayer was self-assembled on the polyimide film doped with Ag nanoparticles.Desired microscale pattern was generated on the self-assembled monolayer by direct laser writing,and copper was then selectively deposited on the patterned areas by electroless plating.Various processes for pre paring the patterned electroless Cu coating were analyzed using an X-ray photoelectron spectroscope,an atomic force microscope,a scanning electron microscope,an attenuation total reflectance Fourier transformation infrared spectrometer,a semiconductor characterization system,and a video based contact angle meter. It has been found that the deposited copper line has a width of 30 μm and good selectivity and conductivity.As a new technology for electroless Cu plating,the present process could be well applied in electronic industry.
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