针对低温银浆固化后出现的断裂失效现象，通过增加烘烤时间、提高烘烤温度、高温高湿下处理、冷冻情况下折叠破坏以及采用溶剂腐蚀等方法进行实验研究。采用放大镜观察以及电阻变化测试，确认了失效原因在于某些溶剂再次溶解了浆料中的树脂，而后出现二次固化收缩，从而出现线路断裂失效现象。
The low temperature silver paste fracture failure after curing were studied by increasing the baking time, improving the baking temperature, processing on the condition of high temperature and high humidity, folding damage under freezing as well as the solvent corrosion. Through an optical magnifier observation and resistance test, the reasons for fracture failure of silver paste were confirmed that a certain solvent redissolved paste resin, result in the twice curing shrinkage and arising line failure phenomenon.
参考文献
| [1] | Ryszard Kisiel;Jan Felba;Janusz Borecki;Andrzej Moscicki .Problems of PCB microvias filling by conductive paste[J].Microelectronics and reliability,2007(2/3):335-341. |
| [2] | 周华,陈苑明,何为,周国云,莫芸绮.键盘式薄膜开关的制造工艺研究[J].电子元件与材料,2011(02):50-53. |
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