=[刊，中]///金属学报.¾2004,40(5).¾ 在循环加载条件下, 单滑移取向的Cu单晶体首先出现驻留滑移线(PSL), 然后随着循环周次的增加转变为驻留滑移带(PSB). 在不同温度、不同时间条件下对疲劳Cu单晶进行真空退火处理, 观察PSB结构在热激活条件下的变化情况. 结果表明, 退火处理过程中由于空位浓度差异所产生的渗透力促使位错运动, 并使PSB的某些部位逐步细化, 以至消失. 实现了PSB的分段相消. 在退火过程中由于应变能的逐步释放, 未观察到再
In single-slip-oriented copper single crystals which were cyclically deformed under constant plastic shear strain amplitude control, the persistent slip line (PSL) was first formed in the vein dislocation structure of matrix, and then it was rather quickly transformed into persistent slip band (PSB) under consecutive cycling. During annealing for the fatigued copper single crystals with PSBs the penetrating force caused by different void densities drives dislocations motion, makes some parts of PSB thinning and finally PSBs disappeared under the mechanism of annihilation part by part. Because of gradual releasing of the strain energy in annealing process, no recrystallized grain has been observed.
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