简要介绍了电子封装发展情况及其对基片材料的性能要求,分析了陶瓷基片作为封装材料性能上的优点,概述了几种常用陶瓷基片材料的优缺点及其应用:Al2O3作为传统的陶瓷基片材料,优点是成熟的工艺和低廉的价格,但热导率不高;BeO、BN、SiC等都具有高热导率,在某些封装场合是合适的选择;AIN综合性能最好,是最有希望的电子封装陶瓷基片材料.介绍了多层陶瓷基片材料的共烧技术和流延成型技术,并指出LTCC技术和水基流延将是未来发展的重点.
参考文献
| [1] | Liu J;Olorunyomi M O;Lu Xiuzhen.New nano-thermal interface material for heat removal in electronic packaging[A].Dresden,2006 |
| [2] | 修子扬,张强,武高辉,宋美慧,朱德志.高体积分数电子封装用铝基复合材料性能研究[J].电子与封装,2006(02):16-19. |
| [3] | 黄文迎,周洪涛.先进电子封装技术与材料[J].精细与专用化学品,2006(16):1-5. |
| [4] | Johnson R. W.;Wang C.;Liu Y.;Scofield J. D. .Power Device Packaging Technologies for Extreme Environments[J].IEEE transactions on electronics packaging manufacturing: A publication of the IEEE Components, Packaging, and Manufacturing Technology Society,2007(3):182-193. |
| [5] | 曲远方.功能陶瓷材料[M].北京:化学工业出版社,2003:296. |
| [6] | 何新华;张庆秋.无机介电材料与应用[M].广州:华南理工大学出版社,2005:148. |
| [7] | Larson S E;Slaby J .Comparison of various suhstrate technologies under steady state and transient conditions[J].Integr Electron Syst Sector,2004,2:648. |
| [8] | Vaed K;Florkey J;Akbar S A et al.An additive micromolding approach for the development of micromachined ceramic substrates for RF applications[J].Journal of Microelectromechanical Systems,2004,3(13):514. |
| [9] | Gorbunova M A;Shein I R .Electronic and magnetic properties of beryllium oxide with 3d impurities from first-principies calculations[J].Physical Review B:Condensed Matter,2007,1:47. |
| [10] | Shabashov V A;Kijko V S;Dmitriev I A et al.The state of iron impurities in a beryllium ceramic as determined from NGRS data[J].Ceramics International,2004,30:1. |
| [11] | Li X L;Ma H A;Zheng Y J et al.AIN ceramics prepared by high-pressure sintering with La2O3 as a sintering aid[J].Journal of Alloys and Compounds,2007,10:1016. |
| [12] | Kume S;Masaki Y;Naoki O et al.Dielectric properties of sintered aluminum nitfide[J].International Journal of Refractory Metals and Hard Materials,2005,4(23):382. |
| [13] | Liang Q;Zhou H P;Fu R L et al.Thermal conductivity of AlN ceramics sintered with CaF2 and YF3[J].Ceramics International,2003,29:893. |
| [14] | Li X L;Ma H A;Zuo G H et al.Low-temperature sintering of high-density aluminium nitride ceramics without additives at high pressure[J].Scripta Materialia,2007,12(56):1015. |
| [15] | Kume S;Masaki Y;Lee S K et al.Dielectric and themal properties of AlN ceramics[J].Journal of the European Ceramic Society,2007,27:2967. |
| [16] | Chandrashekar R;Paulo M .Boron nitilde finds new applications in thermoplastic compounds[J].Plast Addit Compounding,2008,10:26. |
| [17] | Nakano H;Watari K;Kinemuchi Y et al.Mierostructural characterization of high-thermal-conductivity SiC ceramics[J].Journal of the European Ceramic Society,2004,14(24):3685. |
| [18] | 郝洪顺,付鹏,巩丽,王树海.电子封装陶瓷基片材料研究现状[J].陶瓷,2007(05):24-27. |
| [19] | Li W X;Lannutti J J .Curvature evolution in LTCC tapes and laminates[J].IEEE Transs Components Packaging Techn,2005,28:149. |
| [20] | Ozel E;Kurama S .Production of cordierite ceramic by aqueous tape casting process[J].Journal of Materials Processing Technology,2008,198:68. |
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