应用自组装技术在Cu(OH)2纳米柱/CuO微花阶层结构表面制备硬脂酸自组装膜(SAM),运用电化学阻抗谱探讨了形成自组装膜的较佳浓度和自组装时间,通过极化曲线和循环伏安法考察了硬脂酸自组装膜在0.1 mol/L NaCl溶液中对铜电极的缓蚀性能.结果表明,当CuO/Cu(OH)2电极在8 mmol/L硬脂酸溶液中自组装24 h时,得到的硬脂酸自组装膜能显著提高铜电极的耐蚀性；与裸铜电极相比,SAM-CuO/Cu(OH)2电极的腐蚀电流降低了2个数量级,缓蚀效率达到98.81％.
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