用扫描电子显微镜(SEM)、原子力显微镜(AFM)等表面分析方法,考察了反应烧结碳化硅(RBSC)材料在纯氧气中的氧化行为.结果表明,反应烧结SiC(RBSC)表面残余Si比Q-SiC拥有更多的缺陷,初期氧化速率更快.表面粗糙度的变化在一定程度上也反映了氧化发生的过程.结合氧化动力学、SEM及AFM,建立了RBSC初期氧化过程的生长模型.提供表面三维信息的AFM和分析成分与形貌信息的SEM技术是研究表面氧化过程尤其是初期氧化十分方便有效的工具.
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