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以氧化锡(SnO2),五氧化二铌(Nb2O5)和三氧化二锑(Sb2O3)粉末为原料,通过无压固相烧结技术制备了SnO2基导电陶瓷,研究了Nb2O5单掺杂及Nb2O5-Sb2O3双掺杂SnO2基陶瓷的电导率和热膨胀性.采用X射线衍射仪对试样物相结构进行了表征.研究发现,当Nb2O5掺杂量为14%(摩尔分数,下同)时,SnO2基陶瓷800℃的电导率迭10.51S/cm;在此基础上,当Sb2O3添加量为2%时,500℃的电导率达1.61S/cm.SnO2-Nb2O5基陶瓷的热膨胀系数随Nb2O5掺杂量的增加而降低,Sb2O3的添加使SnO2基陶瓷的热膨胀系数增大.X射线衍射仪分析结果表明,Nb2O5能均匀分布在SnO2粉末中,形成稳定的固溶体;Sb2O3的添加不利于Nb2O5形成稳定的固溶体.

参考文献

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