采用直接镀工艺,在铝基体上获得了化学镀N-P、Ni-Cu-P各种结构镀层.用X射线衍射分析了镀层结构;用SEM观察了各种结构镀层的表面形貌;测定了各种结构镀层的镀速和结合力;利用线性极化和阳极极化曲线分析了各种结构镀层的耐蚀性能.结果表明,利用直接化学镀工艺可以在铝基上获得结合力良好的镀层;通过控制络合剂的用量可以得到不同结构和不同铜含量的Ni-Cu-P镀层;当镀层达到一定厚度后,Cu元素可以显著提高镀层的耐蚀性能.
参考文献
[1] | Reidel W.Electroless Nickel Plating[M].Redwood Press,1991 |
[2] | American Society for Metals.Metal Handbook[M].,1983:219-243. |
[3] | Ashassi-Sorkhabi H.;Dolati H.;Parvini-Ahmadi N.;Manzoori J. .Electroless deposition of Ni-Cu-P alloy and study of the influences of some parameters on the properties of deposits[J].Applied Surface Science: A Journal Devoted to the Properties of Interfaces in Relation to the Synthesis and Behaviour of Materials,2002(3/4):155-160. |
[4] | Gao Y;Zheng Z J;Zhu M et al.[J].Materials Science and Engineering A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2004,381:98-103. |
[5] | Sankara Narayanan T S N;Selvakumar S;Stephen A .[J].Surface and Coatings Technology,2003,172:298-307. |
[6] | Krasteva N;Annyanov S .[J].Eletrochemical Society,1994,141(10):2864-2867. |
[7] | Wang Y W;Deng Z .[J].Plating & Surface Finishing,1992,79:57-59. |
[8] | 高岩,郑志军,曹达华.铝基化学镀Ni-P前处理工艺对镀层结合力的影响[J].电镀与环保,2005(02):21-23. |
[9] | Mallory G O;Hajdu J B.Electroless plating Fundermentals and Applications[M].Orlando,FL:AESF,1990 |
[10] | Lee C Y;Lin KL .[J].Thin Solid Films,1994,239:93-98. |
[11] | Cherkaoui M;Srhiri A;Chassaing E .[J].Plating & Surface Finishing,1992,79:68-71. |
[12] | 胡文彬;刘磊.难镀基材的化学镀镍技术[M].北京:化学工业出版社,2003:134. |
[13] | 张允诚;胡如南.电镀手册[M].北京:国防工业出版社,1997:958. |
[14] | LelentalM .[J].Journal of the Electrochemical Society,1975,122(04):486-490. |
[15] | ASTM B5710-1984.ASTM B5710-1984.Standard Test Methods for Adhesion of Metallic Coatings[S]. |
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