目的：准确测定结晶器铜板涂层的界面结合强度。方法考虑到结晶器铜板的涂层属于厚韧性涂层/韧性基体材料体系，宜采用标准的剪切法定量测量其界面结合强度。推荐井玉安等设计的涂层宽度为1 mm的剪切试样及专用模具，并通过该方法测试铜合金基材、电镀层/铜合金、喷涂层/铜合金的界面结合强度。结果测得的铜合金基材的剪切强度离散系数最小；各类涂层的结合强度值离散性与GB/T 13222-1991方法测出的数据相比，相对较小。结论推荐的测试方法较GB/T 13222-1991方法准确度高，适合于结晶器铜板涂层的结合强度测试，且测试时宜先测铜合金基材的剪切强度，以有效减小试验的系统误差。
Objective To accurately determine the interface bonding strength between coating and mold copper. Methods Con-sidering that the casting mold coating belongs to a kind of thick, tough coating ﹠ toughness-based material, a standard shearing strength test method was used to measure its interface bonding strength. It was suggested to measure the bonding strength on coating interface using the series of specific mold with a sample of 1 millimeter in width as established by Mr. Jing Yu-an. Then interface bonding strength of the copper, electroplate layer/copper alloy, spray layer/copper alloy were researched. Results By testing and analyzing, the variance coefficient of shearing strength for copper was the lowest and the variance coefficients measured using Jing′s method were lower than those measured with GB 13222-1991 for all kinds of layers. Conclusion The veracity of Jing′s method was better than that of GB 13222-1991 and it was more suitable for testing the bonding strength of mold copper coating. In order to reduce system errors, the copper′s shearing strength must be tested at first.
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