通过正交试验对比分析了镀液pH值,主盐、还原剂以及络合剂浓度等因素对铝基表面化学镀镍-磷镀层磷含量及镀速的影响.结果表明:镀液pH值的影响最主要,其次为主盐和还原剂浓度;对于选定成分的酸性(3.5≤PH≤6)镀液,随pH值的增大,镀层磷原子分数由22.50o(pH=3.5)逐渐减至12.600(pH=6.0),而镀速随pH值的增大而增加,达到最大值21.0 μm·h-1(pH=5.0)后变化不大;镀层磷含量随主盐NiSO4浓度增大而降低,随还原剂NaH2PO2浓度增大而增加,而主盐和还原剂浓度的增大都可增加镀速;最终获得了磷原子分数为15.2%,镀速达到21.0 μm·h-1的镀层.
参考文献
[1] | Effect of reaction time and P content on mechanical strength of the interface formed between eutectic Sn-Ag solder and Au/electroless Ni(P)/Cu bond pad[J].Journal of Applied Physics,2003(6):4108-4115. |
[2] | Jeong-Won Yoon;Seung-Boo Jung;Chang-Bae Lee .Growth of an Intermetallic Compound layer with Sn-3.5Ag-5Bi on Cu and Ni-P/Cu during Aging Treatment[J].Journal of Electronic Materials,2003(11):1195-1202. |
[3] | Ahmed Sharif;Y.C. Chan .Investigation of interfacial reactions between Sn-Zn solder with electrolytic Ni and electroless Ni(P) metallization[J].Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics,2007(1/2):117-121. |
[4] | Qi G.;Chen X.;Shao Z. .Influence of bath chemistry on zincate morphology on aluminum bond pad[J].Thin Solid Films: An International Journal on the Science and Technology of Thin and Thick Films,2002(1/2):204-209. |
[5] | Kumar A;Chen Z .Influence of solid-state interfacial reactions on the tensile strength of Cu/electroless Ni-P/Sn-3.5Ag solder joint[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2006(1-2):175-179. |
[6] | 杨海燕,朱万学.非晶化学镀镍工艺研究与应用[J].腐蚀与防护,2004(03):121-123. |
[7] | 万家瑰,李淑华,冯小军.铝基化学镀Ni-P合金工艺研究[J].电镀与精饰,2007(03):42-44. |
[8] | 李学伟,赵国刚.Ni-P化学镀高稳定性镀液及优化工艺[J].黑龙江科技学院学报,2004(06):327-330. |
[9] | 蔡晓兰,黄鑫,贺子凯.化学镀镍磷合金镀速的研究[J].电镀与涂饰,2001(06):39-41. |
[10] | 关凯书,梁安波,吕宝君,张美华,王志文.磷含量对镍磷化学镀层结构及表面形貌的影响[J].机械工程材料,2000(02):20-21,27. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%