研究了机械合金化制备的纳米晶W-xCu(x=15,20,25)复合粉末的烧结行为.结果表明,纳米晶W-Cu复合粉末烧结致密化强烈地依赖于烧结温度与烧结时间.当烧结温度从1 150℃提高到1 200℃时,烧结30min后的烧结体相对密度由91%～94%增加到97%～98%;当烧结温度超过1 300℃时,烧结体发生快速致密化,5 min内相对密度即可达到98%左右.研究还发现,W-Cu合金中W晶粒尺寸也强烈地依赖于烧结温度,即烧结温度愈高,W晶粒长大愈显著.当压坯在1 200～1 250℃烧结30 min后,所得到的晶粒度约为300～500 nm,其中经1 200℃烧结时的晶粒尺寸约为300～350 nm.另外,Cu含量增加有利于烧结致密化,并降低W晶粒长大的趋势.
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