具有高导热性的铜基封装材料可以满足大功率器件即时快速大量散热的要求,是一种重要的封装材料.综述了Cu/Mo、Cu/W传统铜基封装材料和Cu/C纤维、Cu/Invar(Mo、Kovar)/Cu层状材料、Cu/ZrW2O8(Ti-Ni)负热膨胀材料及Cu/SiC、Cu/Si轻质材料等新型铜基封装材料的性能特点、制备工艺与问题.指出轻质Cu/Si复合材料将是铜基封装材料中一个新的具有前景的研究方向.
参考文献
[1] | Zhu Dezhi.Fabrication and properties of SiC/Cu composites for electronic packaging[A].Shenzhen,2005:191. |
[2] | Sunil Jha.CUVAR-a new controlled expansion,high conductivity material for electronic thermal management[A].Las Vegas,Nevada,1995:542. |
[3] | 陈仕国,戈早川,杨海朋,白晓军.聚合物基电子封装复合材料研究进展[J].宇航材料工艺,2007(05):4-7. |
[4] | 吴泓,王志法,郑秋波,周俊.铜基电子封装复合材料的回顾与展望[J].中国钼业,2006(03):30-32. |
[5] | 刘正春,王志法,姜国圣.金属基电子封装材料进展[J].兵器材料科学与工程,2001(02):49-53. |
[6] | 夏扬,宋月清,崔舜,林晨光,韩胜利.Mo-Cu和W-Cu合金的制备及性能特点[J].稀有金属,2008(02):240-244. |
[7] | 王铁军,周武平,熊宁,刘国辉.电子封装用粉末冶金材料[J].粉末冶金技术,2005(02):145-151. |
[8] | Yih Pay;Chung D D L .Copper-matrix molybdenum particle composites made from copper coated molybdenum powder[J].Journal of Electronic Materials,1995,24(07):841. |
[9] | Yih P.;Chung DDL. .A COMPARATIVE STUDY OF THE COATED FILLER METHOD AND THE ADMIXTURE METHOD OF POWDER METALLURGY FOR MAKING METAL-MATRIX COMPOSITES[J].Journal of Materials Science,1997(11):2873-2882. |
[10] | 吴泓,王志法,姜国圣,崔大田,郑秋波.钨粉化学镀铜对W/15Cu电子封装材料性能的影响[J].稀有金属材料与工程,2007(03):550-553. |
[11] | Calder J C.Graphite fiber composites for CTE control in thermal management[packaging][A].Salzburg,Austria,1998:160. |
[12] | Korab J;Korb G;Sebo P.Thermal expansion and thermal conductivity of continuous carbon fibre reinforced copper matrix composites[J].Electron Manuf Techn Symp,1998:27-29 1104. |
[13] | Liu L;Tang YP;Zhao HJ;Zhu JH;Hu WB .Fabrication and properties of short carbon fibers reinforced copper matrix composites[J].Journal of Materials Science,2008(3):974-979. |
[14] | S.K.Datta;S.N.Tewari .Copper alloy-impregnated carbon-carbon hybrid composites for electronic packaging applications[J].Metallurgical and Materials Transactions, A. Physical Metallurgy and Materials Science,1999(1):175-181. |
[15] | 邹柳娟;范志强;朱孝谦 .碳纤维增强铜基(碳/铜)复合材料的研究现状与展望[J].材料导报,1998,12(03):56. |
[16] | Stefanik P;Sebo P .Thermal expansion of copper-carbon fiber composites[J].Theoretical and Applied Fracture Mechanics,1994,20(01):41. |
[17] | 杨会娟,王志法,王海山,莫文剑,郭磊.电子封装材料的研究现状及进展[J].材料导报,2004(06):86-87,90. |
[18] | 郑秋波,王志法,姜国圣,崔大田,吴泓.电子封装用CPC新型层状复合材料的研制[J].中国钼业,2005(06):41-44. |
[19] | 周俊,王志法,崔大田,吴化波.Cu/Mo/Cu电子封装材料中Mo的分层问题[J].中国钼业,2007(05):54-56. |
[20] | 罗丰华,陶玉强,戴恩斌,陈康华.热致收缩ZrW2O8化合物及其复合材料[J].材料导报,2005(11):73-78. |
[21] | Jin-Feng Li;Zi-Qiao Zheng;Xi-Wu Li;Zhuo-Wei Peng .Application Of Shape Memory Alloy Tini In Low Thermal Expansion Copper Composites[J].Materials & design,2009(2):314-318. |
[22] | Watanabe, H;Tani, J;Kido, H;Mizuuchi, K .Thermal expansion and mechanical properties of pure magnesium containing zirconium tungsten phosphate particles with negative thermal expansion[J].Materials Science and Engineering. A, Structural Materials: Properties, Microstructure and Processing,2008(1/2):291-298. |
[23] | H. Mavoori;S. Jin .Low-thermal-expansion copper composites via negative CTE metallic elements[J].JOM,1998(6):70-72. |
[24] | C. Verdon;D. C. Dunand .HIGH-TEMPERATURE REACTIVITY IN THE ZrW_2O_8-Cu SYSTEM[J].Scripta materialia,1997(9):1075-1080. |
[25] | S. YILMAZ;D.C. DUNAND .Finite-element analysis of thermal expansion and thermal mismatch stresses in a Cu-60vol percent ZrW_2O_8 composite[J].Composites science and technology,2004(12):1895-1898. |
[26] | 甘卫平,陈招科,杨伏良,周兆锋.高硅铝合金轻质电子封装材料研究现状及进展[J].材料导报,2004(06):79-82. |
[27] | Sundberg G;Paul P;Sung CM;Vasilos T .Fabrication of CuSiC metal matrix composites[J].Journal of Materials Science,2006(2):485-504. |
[28] | Schubert Th et al.Intedacial design of Cu-based composites prepared by powder metallurgy for heat sink applications[J].Mater Sei Eng A,2008,475(1-2):39. |
[29] | Th. Schubert;A. Brendel;K. Schmid .Interfacial design of Cu/SiC composites prepared by powder metallurgy for heat sink applications[J].Composites, Part A. Applied science and manufacturing,2007(12):2398-2403. |
[30] | Yih P.;Chung DDL. .SILICON CARBIDE WHISKER COPPER-MATRIX COMPOSITES FABRICATED BY HOT PRESSING COPPER COATED WHISKERS[J].Journal of Materials Science,1996(2):399-406. |
[31] | Xing Hongwei et al.Intedacial reactions in 3D-SiC network reinforeed Cu-matrix composites prepared by squeeze casting[J].Materials Letters,2005,59(12):1563. |
[32] | Shu KM.;Tu GC. .The microstructure and the thermal expansion characteristics of Cu/SiCp composites[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2003(1/2):236-247. |
[33] | Microstructure and thermo-mechanical properties of pressureless infiltrated SiCp/Cu composites[J].Composites science and technology,2008(13):p.2731. |
[34] | 朱建华,刘磊,胡国华,沈彬,胡文彬,丁文江.复合电铸制备Cu/SiCp复合材料[J].中国有色金属学报,2004(01):84-87. |
[35] | Kang Hyun-Ki;Kang Suk-Bong .Thermal decomposition of silicon carbide in a plasma-sprayed Cu/SiC composite deposit[J].MATERIALS SCIENCE & ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING,2006,428(1-2):336. |
[36] | Martinez V.;Ordonez S.;Castro F.;Olivares L.;Marin J. .Wetting of silicon carbide by copper alloys[J].Journal of Materials Science,2003(19):4047-4054. |
[37] | Lee YF;Lee S.-L. -- .Effects of Al additive on the mechanical and physical properties of silicon reinforced copper matrix composites[J].Scripta materialia,1999(7):773-778. |
[38] | Levin L et al.The mechanisms of phase transfo-rmation in diffusion couples of the Cu-Si system[J].Materials Chemistry and Physics,1995,40(01):56. |
[39] | Chromik R R;Neils W K;Cotts E J .Thermodynamic and kinetic study of solid state reactions in the Cu-Si system[J].Journal of Applied Physics,1999,86(08):4273. |
[40] | Zacharatos F;Nassiopoulou A G .Copper-filled nlacroporous Si and cavity underneath for microchannel heat sink technology[J].PHYSICA STATUS SOLIDI A-APPLIED RESEARCH,2008,205(11):2513. |
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分:
-
10%
-
20%
-
30%
-
40%
-
50%