对高层错能的纯Cu和低层错能的Cu-30％Zn(质量分数)合金进行室温多向压缩变形及退火实验,并利用OM、SEM/EBSD、TEM技术及电子万能试验机对其在变形和退火过程中的晶粒细化情况和不同累积变形量(∑ε)后的拉伸力学性能进行观察和分析.结果表明:在多向压缩过程中,随着层错能的降低,铜合金的晶粒细化机制由传统的连续动态再结晶(cDRX)细化机制转变成孪晶分割晶粒细化机制.在变形过程中,两者的真应力-累积应变(σ-∑ε)曲线呈现稳态流变特征;当Σε＞2.4后,层错能较低的Cu-30％Zn合金仍存在缓慢的加工硬化,而纯Cu仅在Σε＜2.4阶段存在加工硬化.随着∑ε的增大,层错能较低的Cu-30％Zn合金晶粒细化比纯Cu的更加明显:当Σε=2.4时,Cu-30％Zn合金内部基本为细小的晶粒,这是由其内部的孪晶交叉、分割晶粒而形成;而纯Cu仅在局部出现细晶.随着∑ε的增大,Cu-30％Zn合金内部的畸变程度以及变形后的强度也远大于纯Cu的.经Σε=2.4多向压缩变形后,在退火过程中,层错能较低的Cu-30％Zn合金再结晶晶粒明显比纯Cu细小,这是由于其内部层错密度较大,再结晶形核点较多所致.
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