通过阶梯降压法,成功制备出带有铝基底的有序多孔阳极氧化铝,铝基底与有序多孔氧化铝之间的阻挡层极薄.以该模板为阴极,采用循环伏安法电化学沉积技术制备出Cu/AAO纳米复合材料.分别用场发射扫描电子显微镜(FESEM)、透射电子显微镜(TEM)、X射线衍射(XRD)等测试方法对该纳米复合材料的形貌、组成和结构进行了表征和分析.结果表明,Cu纳米线在模板中填充率高,直径约为70nm,长度可达30μm,具有面心立方单晶结构.
Ordered porous anodic aluminum oxide (AAO) template with an ultrathin barrier and an Al substrate was successfully prepared by a method of step-by-step voltage decrement.Cu/AAO composite was prepared by electrodepositing Cu in the above-prepared AAO template by a cyclic voltammetry method.The morphology,composite and structure of Cu/AAO composite were characterized by field emission scanning electron microscopy (FESEM),transmission electron microscopy (TEM) and X-ray diffraction (XRD).The results indicate that the Cu nanowires have a face centred cubic single crystalline structure,the filling degree of Cu nanowires in the AAO template is high and the diameter of the nanowire is about 70nm with a length up to 30μm.
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