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为了解玻璃化过程氢键结构特性,采用分子模拟的手段计算了三种压力下的水玻璃化过程氢键的角度、距离、生命期和数量.计算结果显示:(i)氢键角度呈现泊松分布的特征,随着温度降低分布氢键角度分布范围变窄,峰值变高,在0~13°范围,随温度降低,分布数值变大;而在大于13°,随温度降低,分布数值变小;(ii)氢键距离也呈现泊松分布的特征,随着温度降低分布氢键距离分布范围变窄,峰值变高,在0.15~0.18nm范围,随温度降低,分布数值变大;而在0.18~0.27 nm范围,随温度降低,分布数值变小;(iii)氢键生命周期以类似自变量系数为负的幂函数或者指数函数形式分布,随温度降低,氢键生命期的分布范围和分布数值都呈现明显差异;(iV)压力对氢键生命期分布曲线的趋势无明显影响,但是低于一定温度不同压力下的氢键生命期分布曲线波动程度出现差异,导致平均生命期出现差异,(V)三种压力下氢键总量和每个水分子氢键平均数量都随温度的降低而上升,并且数值很接近.随着玻璃化进程的进行,完全自由的水分子数(f0)逐渐降低,形成四面体状的氢键数(f4)从290 K到260 K时有急剧上升的过程,以后就变化不大.形成一个,两个,三个氢键的份额总体上呈现变大的趋势.f4跟f1 f2,f3,比起来很小,反映了结晶度很低.

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