表面机械研磨处理制备纳米晶Ni的晶粒生长动力学

材料热处理学报, 2011, 32(z1): 121-126.

表面机械研磨处理制备纳米晶Ni的晶粒生长动力学

李伟 ^1, , 刘平 ^2, , 马凤仓 ^3, , 刘新宽 ^4, , 陈小红 ^5, , 戎咏华 ^6,

1.上海理工大学材料科学与工程学院,上海200093;上海交通大学材料科学与工程学院,上海200240

2.上海理工大学材料科学与工程学院,上海200093

3.上海理工大学材料科学与工程学院,上海200093

4.上海理工大学材料科学与工程学院,上海200093

5.上海理工大学材料科学与工程学院,上海200093

6.上海交通大学材料科学与工程学院,上海200240

基金项目: 国家自然科学基金项目(50871069) 上海市科委基础研究重点项目(10JC1411800) 上海市教委重点学科项目(J50503) 上海市教委“晨光计划”项目(09CG51) 上海高校选拔培养优秀青年教师科研专项基金项目(slg09015)

关键词：表面机械研磨处理 , 纳米材料 , 晶粒生长动力学 , 镍 , 热稳定性

Grain growth kinetics of nanocrystalline nickel produced by surface mechanical attrition treatment

利用表面机械研磨处理(SMAT)技术在纯Ni上制备一定厚度的纳米晶表层,利用X射线衍射(XRD)和透射电镜(TEM)研究了纳米晶Ni的晶粒生长动力学,计算了描述晶粒生长动力学的时间指数n和晶粒生长激活能Q.研究表明,纳米晶Ni在423～723 K退火时的时间指数n约为0.14.当纳米晶Ni在423 ～523 K退火时,其晶粒生长激活能Q为32.1 kJ/mol,表明在这一温度区间内晶粒生长由晶界和亚晶界的微结构重新排列所控制；当纳米晶Ni在523～723 K退火时,晶粒生长激活能Q为121.3 kJ/mol,表明在这一温度区间内晶粒生长由晶界扩散所控制.TEM观察表明纳米晶Ni在较高温度下退火时出现异常的晶粒长大现象.

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