高温、高湿环境中时效时Sn-Zn基无铅焊点的显微组织演化

中国有色金属学报, 2006, 16(7): 1177-1183.

高温、高湿环境中时效时Sn-Zn基无铅焊点的显微组织演化

韦习成 ^1, , 鞠国魁 ^2, , 孙鹏 ^3, , 程兆年 ^4, , 上官东凯 ^5, , 刘建影 ^6,

1.上海大学,材料科学与工程学院,上海,200072;上海大学,新型显示与应用集成教育部重点实验室中瑞联合微系统集成技术中心,上海,200072

2.上海大学,材料科学与工程学院,上海,200072

3.上海大学,新型显示与应用集成教育部重点实验室中瑞联合微系统集成技术中心,上海,200072

4.上海大学,新型显示与应用集成教育部重点实验室中瑞联合微系统集成技术中心,上海,200072

5.上海大学,新型显示与应用集成教育部重点实验室中瑞联合微系统集成技术中心,上海,200072;美国伟创立公司,先进组装和环境技术部,San Jose,CA,USA

6.上海大学,新型显示与应用集成教育部重点实验室中瑞联合微系统集成技术中心,上海,200072

基金项目: 上海市科委资助项目(045107006;035007031) 欧盟"Flex-Eman"资助项目(COOP-CT-2003-507983)

关键词： Sn-Zn基焊料 , 时效 , 湿度 , 显微组织 , 低周疲劳

Microstructure evolution of Sn-Zn based lead-free solder joints aged in humid atmosphere at high temperature

研究Sn-Zn基焊料经高温和高湿环境时效后的显微组织演化.在涂覆Au/Ni合金的PCB镀铜焊盘上焊接3种Sn-Zn基焊料的试样(Sn-9Zn合金、Sn-8Zn-3Bi合金以及Sn-7Zn-Al(30×10-6)合金),然后在120℃,100%相对湿度、2.03×105Pa下分别时效96 h和192 h.结果表明,Zn原子向表面和界面扩散,形成富Zn相并长大.粗大的Zn相易于导致O元素的富集,使与β-Sn界面弱化,从而降低在位移控制加载模式下的低周疲劳寿命.

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