退火Cu-W薄膜组织结构与残余应力

稀有金属材料与工程, 2007, 36(3): 435-439.

退火Cu-W薄膜组织结构与残余应力

汪渊 ^1, , 李晓华 ^2, , 宋忠孝 ^3, , 徐可为 ^4, , 尉秀英 ^5,

1.北京有色金属研究总院能源材料与技术研究中心,北京,100088

2.北京工业大学信号与信息处理研究室,北京,100022

3.西安交通大学金属材料强度国家重点实验室,陕西,西安,710049

4.西安交通大学金属材料强度国家重点实验室,陕西,西安,710049

5.北京有色金属研究总院能源材料与技术研究中心,北京,100088

基金项目: 国家自然科学基金(50471035) 国家重点基础研究发展计划(973计划)(2004CB619302)

关键词： Cu-W薄膜 , 相变 , 残余应力 , 真空退火

Phase Structure and Residual Stress in Annealed Cu-W Films

以不同温度真空原位退火工艺为手段,促使制备在单晶Si(100)和Al2O3基底上的Cu-W薄膜发生相变.用X射线衍射(XRD)分析晶体取向,偏振相位移技术分析薄膜残余应力.结果表明,随退火温度变化,薄膜相变呈现连续变化,由初始的非晶态晶化,出现类W的亚稳态固溶体相,以及随退火温度的进一步增加,发生Spinodal分解,亚稳固溶体完全分解为W和Cu两相.薄膜发生相变时产生拉应力作用,而在晶粒生长阶段,拉应力释放.

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材料期刊网

退火Cu-W薄膜组织结构与残余应力

Phase Structure and Residual Stress in Annealed Cu-W Films

参考文献