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介绍了温度、湿度及表面污染程度对锡须成核与生长的影响,并概述了相应的控制措施.结果表明,合适的后处理措施可以有效抑制锡须的生长.

The effects of temperature, humidity and pollution degree of surface on the nucleation and growth of tin whisker were introduced and the corresponding control measures were summarized. The results show that the suitable post-treatment measures can effectively inhibit the growth of tin whisker.

参考文献

[1] NAKADAIRA Y;JEONG S-Y;SHIM J-B et al.Growth of fin whiskers for lead-flee plated leadframe packages in high humid environments and during thermal cycling[J].Microelectronics Reliability,2008,48(01):83-104.
[2] J. W. Osenbach;J. M. DeLucca;B. D. Potteiger;A. Amin;F. A. Baiocchi .Sn-whiskers: truths and myths[J].Journal of Materials Science. Materials in Electronics,2007(1/3):283-305.
[3] OBERNDORFF P;DITTES M;CREMA P.Whisker formation on matte Sn influencing of high humidity[A].IEEE,2005:429-433.
[4] ZHAO J H;SU P;DING M.Mierostructure-based stress modeling of tin whisker growth[A].IEEE,2005:137-144.
[5] RICE D W;PHIPPS P B P;TREMOUREUX R .Atmospheric corrosion of cobalt[J].Journal of the Electrochemical Society,1979,126(09):1459-1466.
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