采用阳极氧化法在铝表面生成一层氧化铝陶瓷,利用该绝缘陶瓷层替代铝基板中的绝缘胶膜,制备了一种阳极氧化铝陶瓷膜铝基板,并将该铝基板应用于LED照明.测试结果显示:阳极氧化铝陶瓷膜的电气强度可达120 V/μm,体积电阻率大于106 MΩ?cm,采用该技术制备的铝基板的"整体热阻"可降低至0.34 K?cm2/W.LED灯具应用表明,其热阻比普通铝基板的热阻降低9.1℃/W,比填料型高导热铝基板降低4.6℃/W,因此,基于该技术的铝基板具有明显的导热性能优势.
An anodized aluminum oxide (AAO) layer was generated on the aluminum surface by anodic oxidation method, and a metal core printed circuit board(MCPCB) was prepared using the AAO layer in-stead of insulating adhesive film, then the MCPCB was applied in LED lighting. The test results indicate that the electric strength of the AAO film is up to 120 V/μm, and the volume resistance is larger than 106 MΩ?cm. Due to the high thermal conductivity of AAO film, the"overall thermal resistance"of the MCPCB can decrease to 0.34 K?cm2/W. The application results of the MCPCB in LED lighting show that its thermal resistance decreases by 9.1℃/W and 4.6℃/W than the normal MCPCB and the high conduc-tive MCPCB with filler, respectively.
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