欢迎登录材料期刊网

材料期刊网

高级检索

TiNiCu形状记忆合金薄带凭借其窄相变滞后、优异的形状记忆效应与超弹性、良好的热循环稳定性成为一种很有前途的微驱动器材料.本文全面阐述了国内外在TiNiCu薄带研究方面的最新进展,主要包括晶化行为、显微组织、马氏体相变行为、形状记忆效应与超弹性,重点介绍了热处理工艺.显微组织-性能之间的内在联系,探讨了TiNiCu薄带今后的研究重点.

参考文献

[1] Miyazaki S;IshidaA .[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,1999,273-275:106.
[2] Ishida A;Martynov V .[J].MRS Bulletin,2002,27:111.
[3] Furuya Y;Matsumoto M;Kimura H S et al.[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,1991,147:7.
[4] Xie Z L;Van J Humbeeck;Liu Y et al.[J].Scripta Materialia,1997,37:363.
[5] Mercier O;Melton K N .[J].Metallurgical and Materials Transactions,1979,10A:387.
[6] Nam T H;Saburi T;Shimizu K .[J].Materials Transactions-Japan Institute of Metals,1990,31:959.
[7] Furuya Y;Matsumoto M;Kimura H et al.[J].Materials Transactions-Japan Institute of Metals,1990,31:504.
[8] Schlo Broacher P;Boucharat N;Rǒsner H et al.[J].J de Phy IF France,2003,112:731.
[9] Lougzguine D V;Inoue A .[J].Materials Science,2000,35:4159.
[10] Rǒsner H;Shelyakov A V;Glezer A M et al.[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,2001,307:188.
[11] Tong Y X;Lin Y .[J].Journal of Alloys and Compounds,2008,449:152.
[12] Tong Y X;Liu Y;Xie Z L .[J].Journal of Alloys and Compounds,2008,456:170.
[13] Potapov P L;Shelyakov A V;Schryvers D .[J].Scripta Materialia,2001,44:1.
[14] Santamarta R;Schryvers D .[J].Materials Transactions,2003,44:1760.
[15] Santamarta R;Schryvers D .[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,2004,378:143.
[16] Santamarta R;Schryvers D .[J].Intermetallics,2004,12:341.
[17] Rǒsner H;Scblobmacher P;Shelyakov A V et al.[J].Scripta Materialia,2000,43:871.
[18] Cheng G P;Xie z L;Liu Y .[J].Journal of Alloys and Compounds,2006,415:182.
[19] Rǒsner H;Schloβmacher P;Shelyakov A V et al.[J].Acta Materialia,2001,49:1541.
[20] Rǒsner H;Scholβmacher P;Shelyakov A V et al.[J].Materials Transactions,2001,42:1758.
[21] Tong Y X;Liu Y;Xie Z L et al.[J].Acta Materialia,2008,56:1721.
[22] Santamarta R;Cesari E;Pons J et al.[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,2004,35A:761.
[23] Goryczka T;Ochin E .[J].Mater 5ci Eng A,2006,438-440:714.
[24] Cheng G P;Xie Z L;Liu Y .[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,2006,425:268.
[25] Xie ZL;Cheng GP;Liu Y .Microstructure and texture development in Ti50Ni25Cu25 melt-spun ribbon[J].Acta materialia,2007(26):361-369.
[26] Nam T H;Saburi T;Nakata Y et al.[J].Materials Transactions-Japan Institute of Metals,1990,31:1050.
[27] Rǒsner H;Shelyakov A V;Glezer A M et al.[J].Materials Science and Engineering A:Structural Materials Properties Microstructure and Processing,1999,273-275:733.
[28] Kim Y W;Nam T H .[J].Scripta Materialia,2004,51:653.
[29] Morgiel J.;Cesari E.;Pons J.;Pasko A.;Dutkiewicz J. .Microstructure and martensite transformation in aged Ti-25Ni-25Cu shape memory melt spun ribbons[J].Journal of Materials Science,2002(24):5319-5325.
[30] Santamarta R;Schryvers D .[J].Scripta Materialia,2004,50:1423.
[31] Cheng G P;Xie Z L .[J].Journal of Alloys and Compounds,2005,396:128.
[32] Chang S H;Wu S K;Kimura H .[J].Intermetallics,2007,15:233.
[33] 佟运祥;刘勇 .[J].稀有金属材料与工程,2008,37(z3):600.
[34] Furuya Y;Matsumoto M;Kimura H et al.[J].Materials Transactions-Japan Institute of Metals,1990,31:504.
[35] Santamarta R;Cesari E;Pons J et al.[J].Metallurgical and Materials Transactions A:Physical Metallurgy and Materials Science,2004,35A:761.
[36] Cho G B;Yu C I;Lee J H et al.[J].Scripta Materialia,2006,55:597.
[37] Liu Y. .Mechanical and thermornechanical properties of a Ti50Ni25Cu25 melt spun ribbon[J].Materials Science & Engineering, A. Structural Materials: Properties, Misrostructure and Processing,2003(1/2):286-291.
[38] Tong Y X;Lin Y .[J].Materials Chemistry and Physics,2009,120:221.
[39] Nam T H;Kim J H;Kim T Y et al.[J].Journal of Materials Science Letters,2002,21:1851.
[40] Nam T H;Park S M;Kim T Y et al.[J].Smart Materials and Structures,2005,14:S239.
上一张 下一张
上一张 下一张
计量
  • 下载量()
  • 访问量()
文章评分
  • 您的评分:
  • 1
    0%
  • 2
    0%
  • 3
    0%
  • 4
    0%
  • 5
    0%