采用立式烧结熔渗法制备的CuW/Cu0.89wt%Cr整体材料经固溶时效处理后,对其在不同热循环条件下的结合面强度进行了研究.结果表明,在室温~500气温度范围内,随着热循环次数的增加,整体材料的结合面强度和CrCu端合金显微硬度略有提高.而在室温至600℃热循环温度区间内,结合强度和CuCr合金显微硬度随热循环次数的增加而下降.对不同热循环条件下CuCr端合金组织的研究表明,上限温度为500℃时,晶粒没有发生再结晶现象,析出相面心立方的Cr相非常细小、分散,且与Cu基体保持良好的共格关系;而当热循环上限温度为600℃时,晶粒发生了再结晶长大,析出相明显粗化,此时析出的体心立方的Cr相已与Cu基体失去完全共格关系.
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