以机械合金法制备了SnSb-Mo合金,并用XRD、SEM和EDS对合金的成分、组成及形貌等进行了分析;对合金材料的嵌脱锂性能研究发现,合金材料在最初的几次循环较好,但在随后的循环过程中容量迅速下降,通过SEM和EIS的分析发现影响合金材料循环性能的主要原因是合金材料与Cu基体之间的电接触.经过热处理后具有良好的嵌脱锂性能,首次嵌锂容量高达589mAh/g,经过20次循环之后仍具有451mAh/g的容量.
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