研究了施加稳恒磁场（0～1 T）对碳钢表面电镀Ni-W合金的影响。测定了不同方向、不同强度稳恒磁场下的电流效率、合金组成及镀层硬度,并用X射线衍射对镀层的微观结构进行了分析。对实验结果进行了分析讨论,找出了稳恒磁场对上述性能的影响规律。结果表明：与不施加磁场相比,施加磁场后镀层的含钨量上升：当磁场方向垂直于电场方向（B⊥J）,B=1.0 T时,含钨量上升了约11%;当磁场方向平行于电场方向（B∥J）,B=1.0 T时,含钨量上升了约13%;镀层的非晶化程度增强;镀层的硬度提高、孔隙率下降;但Ni-W合金电沉积的电流效率降低。
Effects of stable magnetic field（0-1 T） on electroplating nickel-tungsten alloy films on carbon steel substrate were studied.The current efficiency,composition and microhardness of the nickel-tungsten alloy films electroplated in magnetic fields with different direction and intensity were tested,respectively.The structure of the electroplated alloy films was analyzed by X-ray diffraction.The results show that the content of tungsten in films increases by 11%（under 1.0 T magnetic field perpendicular to electric field） and 13%（under 1.0 T magnetic field parallets to electric field） respectively compared with those electroplated without applying magnetic field.The microhardness and amorphism of the electroplated films also increase and its porosity decreases,while the current efficiency of plating solution decreases in magnetic field.
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