传统二元聚酰胺酰亚胺的软化点和热变形温度较低,耐热性欠佳.本研究以N-甲基吡咯烷酮为溶剂,以偏苯三酸酐(TMA)、均苯四甲酸二酐(PMDA)、4,4'-二苯基甲烷二异氰酸酯(MDI)为单体,进行三元共聚反应,制得一种新型的聚酰胺酰亚胺(PAI).利用傅里叶转换红外光谱(FT-IR)对合成的PAI结构进行了表征,利用热重分析(TGA)、差示扫描量热(DSC)、紫外-可见光谱、宽频介电阻抗谱等对PAI涂层性能进行了测试.结果表明:与传统二元共聚所得的PAI相比,三元共聚型PAI的硬度、热稳定性显著提高,此外,还具有优良的光学性能和电学性能,拓宽了PAI的应用范围.
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