材料微结构的织构化能充分发挥材料中晶体各向异性所表征的物理效应,改善材料的性能.评述了近年来织构化工艺在无铅压电陶瓷材料研究中的应用和进展状况,归纳和分析了热锻(HF)、模板晶粒生长(TGG)、反应模板晶粒生长(RTGG)和多层晶粒生长(MLGG)等技术间的差异、优缺点以及应用范围.重点讲述了TGG和RTGG技术在高对称性钙钛矿型NBT陶瓷中的应用及织构化过程中的晶粒生长机制,展望了今后的发展趋势.
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