利用不同占空比的脉冲电流电沉积法制备了Ni-SiCp复合镀层,结果表明,随着占空比的增大,镍基晶粒尺寸和嵌入SiC沉积含量也随之增加,当占空比为50%时复合镀层达到最大显微硬度值.采用基于电化学阻抗谱结果建立的等效电路模型模拟了不同占空比下电沉积过程的电荷传递电流.模拟结果发现,随着占空比的增大,电荷传递峰电流减小,同时模拟了复合镀层中嵌入SiC颗粒的体积分数.模拟计算结果与试验结果相似.
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