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  4. AIN陶瓷基板材料热导率与烧结助剂的研究进展

材料导报, 2009, 23(17): 56-62.

AIN陶瓷基板材料热导率与烧结助剂的研究进展

张志军 1, , 许富民 2, , 谭毅 3,

1.大连理工大学材料科学与工程学院,大连,116024

2.大连理工大学材料科学与工程学院,大连,116024

3.大连理工大学材料科学与工程学院,大连,116024

基金项目:   国家自然科学基金(50871025)   辽宁省自然科学基金(20051075)  

关键词： A1N , 热导率 , 烧结助剂

Research Progress in Thermal Conductivity and Sintering Additives of A1N Packaging Material

AIN陶瓷因具有高热导率、低介电常数、与硅相匹配的热膨胀系数等优异性能,被认为是替代Al2O3和BeO陶瓷的理想基板材料.主要讨论了AIN陶瓷的导热机理及影响热导率的因素;介绍了A1N陶瓷烧结助刑的选取原则、几种烧结助刺的作用机理及优缺点,并从高温烧结助剂体系和低温烧结助剂体系2个方面介绍了AIN陶瓷研究的最新进展.

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