以HEDTA(N-β-羟乙基乙二胺三乙酸)为主配位剂,通过极化曲线测量、电感耦合等离子体发射光谱、表面形貌分析和X射线衍射谱分析等研究了pH对Sn-Ag-Cu三元合金共沉积的影响.镀液组成及工艺参数为:Sn(CH3SO3)2 110 g/L,Ag2O0.081 1 g/L,Cu(CH3SO3)2 0.876 g/L,HEDTA 278.3 g/L,硫脲4.6 g/L,烷基糖苷1g/L,温度25℃,电流密度10 mA/cm2.结果表明,随pH增大,Sn-Ag-Cu的沉积电位负移.pH为3.22～7.74时,Sn-Ag-Cu合金镀层结晶细致、表面平整.Sn-Ag-Cu合金镀层由Sn、Ag3Sn和Cu6Sn5组成,其结晶取向随pH改变而变.HEDTA体系电沉积Sn-Ag-Cu合金镀层的适宜pH为3.00 ～ 6.00,最优范围是5.00 ～ 6.00.
参考文献
| [1] | Chunfen Han;Qi Liu;Douglas G. Ivey .Electrochemical composite deposition of Sn-Ag-Cu alloys[J].Materials Science & Engineering, B. Solid-State Materials for Advanced Technology,2009(3):172-179. |
| [2] | Shany Joseph;Girish J. Phatak .Effect of additives on the co-electrodeposition of Sn-Ag-Cu lead-free solder composition[J].Materials Science & Engineering, B. Solid-State Materials for Advanced Technology,2010(1/3):219-223. |
| [3] | Jinqiu Zhang;Maozhong An;Limin Chang .Study of the electrochemical deposition of Sn-Ag-Cu alloy by cyclic voltammetry and chronoamperometry[J].Electrochimica Acta,2009(10):2883-2889. |
| [4] | SPEIGHT J G.Lange's Handbook of Chemistry[M].New York:McGraw-Hill,2005:1380-1392. |
| [5] | Yi Qin;G. D. Wilcox;Changqing Liu .Electrodeposition and characterisation of Sn-Ag-Cu solder alloys for flip-chip interconnection[J].Electrochimica Acta,2010(1):183-192. |
| [6] | He, Y.;Gao, X.;Zhang, Y.;Xu, H. .Electrodeposition of Sn-Ag-Cu ternary alloy from HEDTA electrolytes[J].Surface & Coatings Technology,2012(19/20):4310-4315. |
| [7] | 高学朋,张莹莹,贺岩峰.HEDTA对甲基磺酸盐镀液中锡-银-铜三元合金共沉积的影响[J].电镀与涂饰,2013(03):5-8. |
| [8] | Yutaka ujiwara;Hidehiko Enomoto .Intermetallic phase formation in electrochemical alloy deposition[J].Journal of solid state electrochemistry,2004(3):167-173. |
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