为了使微波基板材料与Cu金属衬底的热膨胀性能匹配,对陶瓷/聚四氟乙烯(PTFE)微波复合基板材料的热膨胀性能进行了研究.采用湿法工艺制备了以SiO2和TiO2为填料的SiO2-TiO2/PTFE复合材料,研究了复合材料密度、填料粒度和填料体积分数对SiO2-TiO2/PTFE复合材料热膨胀性能的影响.结果表明,当SiO2的体积分数由0增至40％(TiO2:34％～26％)时,SiO2-TiO2/PTFE复合材料的线膨胀系数(CTE)由50.13×106K-1减小至10.03×106K-1.陶瓷粉体粒径和复合材料密度减小会导致CTE减小.通过ROM、Turner和Kerner模型计算CTE发现,ROM和Kerner模型与实验数据较相符,而实验值与Turner模型预测值之间的差异随PTFE含量的升高而逐渐增大.
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