The dynamic aspects of linear elastic fracture mechanics applied to dielectric breakdown are studied. In the same direction as the fracture mechanics analogue for dielectric breakdown described previously by some researchers, this paper develops the intrinsic, rate-dependent bond breakdown micromechanism to account for the dynamic process of dielectric breakdown. The formulae of conducting microcrack growth rate and lifetime prediction are derived and applied to the experimental data of SiO2 films.
参考文献
上一张
下一张
上一张
下一张
计量
- 下载量()
- 访问量()
文章评分
- 您的评分：
-
10%
-
20%
-
30%
-
40%
-
50%