用Multi-physics Comsol软件对工业硅真空感应精炼过程的电磁场和流场进行了数值模拟,定量研究了精炼过程熔池中电磁场和流场动态分布特征.结果表明:磁感应强度集中在线圈高度范围的区域,在径向由表及里衰减;电源输入频率对硅熔体的流场分布和流速都有显著影响,电流密度增大会明显增大搅拌速度;当频率为3000 Hz时,硅熔体表现为先从坩埚内壁向下再由坩埚中心向上隆起然后流向四周的循环流动特征,流场内部存在上下两个涡核,搅拌形成的这种循环流动有利于传热和杂质元素向硅熔体表面迁移和挥发.
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