采用正交试验法(三因素三水平),研究烧结工艺(烧结温度、保温时间、升温速率)对自主设计的CaO-B2O3-SiO2微晶玻璃的介质损耗的影响,因素主次顺序为烧结温度、升温速率、保温时间.选取优化工艺(烧结温度900℃、升温速率8℃/min、保温时间10min)烧结,测定介质损耗为1.81×10-4,介电常数为5.6(1MHz);对样品进行XRD衍射分析,结果表明,晶相依次为CaSiO3、CaB2O4和少量SiO2;SEM形貌分析、EDS分析验证了CaSiO3的存在;微观结构分析表明烧结温度的升高有利于晶粒长大、气孔减少、降低介质损耗.
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