室温下对纯铜进行异步叠轧,制备超细晶铜材,研究了异步叠轧过程中纯铜显微组织演变、界面复合以及力学性能的变化.结果表明:搓轧区的存在促进了界面的复合和晶粒的细化；经六道次异步叠轧后可以使纯铜的平均晶粒尺寸从30 μm减小到1μm,抗拉强度为450.3 MPa,屈服强度为346.5 MPa,轧制面显微硬度为108.5 HV,横截面显微硬度为66.3 HV,纵截面显微硬度为77.4 HV,伸长率为3％.
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