采用声发射监测悬臂梁弯曲实验法测量并计算出HCD离子镀法制备的精细TiN陶瓷薄膜的抗拉强度,及其与钛基材界面抗剪切强度(结合强度)值分别是:603MPa,242MPa。
The cantilever bending test, particularly monitored by an acoustic emission technique, was adopted to measure the tensile and interfacial adhesive strengths of the HCD ion-plated fine TiN film on pure Ti substrate. The behaviours of film damaging were found due to: for TiN facing upward, an exceeded internal tensile stress over its tensile strength, and for TiN facing downward, an exceeded shearing stress along film/substrate interface over its adhesive strength. The measured tensile and adhesive strengths are 603 and 242 MPa respectively.
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